A small form factor, low power and highly economic Bluetooth radio module allowing OEMs to add wireless capability to their products. Supports multiple interfaces that make it simple to integrate into fully certified embedded Bluetooth solutions.

Main Features:

• Bluetooth v2.1+EDR, Class 2
• Profiles including HS/HF, A2DP, AVRCP, OPP, DUN, SPP, etc.
• UART and USB programming and data interfaces
• Small form factor
• SMT pads for easy and reliable PCB mounting
• RoHS compliant
• APTX (optional)

Bluetooth 5.0 micro sized dual-mode gateway wireless audio module based on Qualcomm CSR8670. BQB, CE, FCC, TELEC, IC, RoHS certifications. Supporting A2DP, AVRCP, HFP, HSP, SPP, GATT, PBAP profiles, without PCB antenna.

FSC-BT802 integrates an ultra-low-power DSP and application processor with embedded flash memory, a high-performance stereo codec, a power management subsystem, I2S,LED drivers and ADC I/O in a SOC IC. The dual-core architecture with flash memory enables manufacturers to easily differentiate their products with new features without extending development cycles.

Main Features:

• Chipset: CSR 8670/8675; Bluetooth 5.0 Technology, Bluetooth dual module
• Mini Size: 9.7*11.5*1.8mm, Coverage up to 15m (50ft).
• Max Transmit Power: 10 dBm, External antenna is optional
• Support HFP, A2DP, AVRCP, SPP, HID and GATT
• Audio transmitter & receiver

A perfect 4.0 dual-mode module that supports HSP/HFP, A2DP, AVRCP, PBAP, SPP, GATT,etc. Based on CSR8670 which integrates an RF Baseband controller, an ultra-low-power DSP, an application processor with embedded flash memory, a high-performance stereo codec, a power management subsystem and LED and LCD drivers in a SOC IC.

Very small and thin enabling product designers better flexibilities for product shapes.

Main Features:

• Fully qualified Bluetooth 4.0/3.0/2.1/2.0/1.2/1.1
• Postage stamp size: 13* 13 *2mm
• Low power
• Profiles support: HSP/HFP, A2DP, AVRCP, PBAP, SPP, GATT,etc.
• Default UART Baud rate is 115.2Kbps supporting 1200bps- 921Kbps
• UART, I2C, PCM/I2S, nine PIOs, two AIOs
• Stereo codec with 1 channels ADC and 1 microphone inputs
• Support for CSR’s latest CVC technology for narrow-band and wideband voice
• Support APT-X, TWS
• MFI Certification
• RoHS compliant

Bluetooth v4.2 radio and baseband IC that features a Bluetooth portable stack running on a host that supports multiple Bluetooth profiles, such as HFP/HSP, A2DP, AVRCP, PBAP, HID, SPP, iAP and BLE-GATT.

The portable stack can also support various systems, such as Linux, Android, QNX and WinCE for more versatile and easier configuration.

Main Features:

• Fully qualified Bluetooth 4.2
• Mini size: 8mm x 13.5mm x 2.2mm
• Linux and Android support
• High speed data transmission
• RoHS compliant

Bluetooth 4.0 dual-mode module with Software complying with Bluetooth Core v5.0 Specifications.

Bluetooth Low Energy fully compliant system for audio and data communication.

Integrates an ultra-low-power DSP and application processor with embedded flash memory, a high-performance stereo codec, a power management subsystem, I²S, LED drivers and ADC I/O in a SOC IC. The dual-core architecture with flash memory enables manufacturers to easily differentiate their products with new features without extending development cycles.

Main Features:

• Chipset: CSR 8670/8675; Bluetooth 5.0 Technology, Bluetooth dual module
• Mini Size: 13*26.9*2.2mm, Coverage up to 15m(50ft).
• Max Transmit Power: 10 dBm; external antenna optional
• Supports HSP, HFP, A2DP, AVRCP, PBAP, MAP, SPP, BLE
• Powerful, easy-to-use firmware
• Audio transmitter & receiver

A highly integrated Bluetooth module with BT4.2 Smart Ready device (BR/EDR & LE support  simultaneously). Features a V4.2 baseband controller, flash memory, small form factor, and external antenna interface.

Main Features:

• Chipset: CSR8811, v4.0 Bluetooth dual mode
• Product size: 10*11.9*1.7mm    Max Transmit Power: 8dBm
• HFP+A2DP+AVRCP+SPP+HID+PBAP support
• Coverage up to 50m(165ft); external antenna is optional
• Audio Transmitter/Receiver for True Wireless, ShareMe and Intercom systems

Bluetooth 4.2 Smart Ready device (with BR/EDR & LE support simultaneously) . A small form factor, highly power and highly economic Bluetooth radio module that allows OEMs to add wireless capability to their products. Supports multiple interfaces that makes it simple to integrate into fully certified embedded Bluetooth solutions.

Main Features:

• Fully qualified Bluetooth 4.2/3.0/2.1/2.0/1.2/1.1
• Postage stamp size form factor.
• Class 1 support (high output power)
• Integrated chip antenna, transmitting over 100m
• UART Baud rate support from 1200bps up to 921Kbps
• UART, I²C, PCM/I2S data connection interfaces
• Profiles including GATT, OPP, DUN, SPP, etc
• USB 2.0 full-speed device/host/OTG controller
• RoHS compliant
• FCC, CE Certified

FSC-BT1006A integrates an ultra-low-power DSP and application processor with embedded flash memory, a high-performance stereo codec, a power management subsystem, I²S, LED drivers and ADC I/O in a SOC IC.

The dual-core architecture with flash memory enables manufacturers to easily differentiate their products with new features without extending development cycles.

Equipped with powerful and easy-to-use firmware. Easy-to-use and completely encapsulated. Access Bluetooth functionality with simple ASCII commands delivered to the module over serial interface – just like a Bluetooth modem.

Provides an ideal solution for developers who want to integrate Bluetooth wireless technology into their design.

Main Features:

• Dual I²S outputs
• I²S input, SPDIF input (uncompressed PCM only)
• USB audio
• Stereo audio ADC with line input, stereo audio DAC
• Supported sample rates of 8, 11.025, 16, 22.05, 32, 44.1, and48 kHz
• UART interface
• USB 2.0 (full-speed) interface, including USB charger detection
• SPI interface for debug and programming
• I²C master support
• Up to 14general-purpose PIOs
• 3 LED drivers with PWM flasher independent of MCU

Adopts QCC3008 chipset. Bluetooth 5.0 dual mode, supports A2DP, AVRCP, HFP, HSP, SPP, GATT, HOGP, PBAP profiles, audio code support AptX, AptX Low Latency, SBC and AAC.

Integrates an ultra-low-power DSP and application processor with embedded flash memory, a high-performance stereo codec, a power management subsystem, I2S, LED drivers and ADC I/O in a SOC IC. The dual-core architecture with flash memory enables manufacturers to easily differentiate their products with new features without extending development cycles.

Main Features:

• AptX, AptX Low Latency, SBC and AAC audio codecs
• Qualcomm True Wireless Stereo (TWS)
• Configurable Signal Detection to trigger events
• 1 bank of up to 10-stage Speaker Parametric EQ
• 6 banks of up to 5-stage User Parametric EQ for music enhancement
• Qualcomm Expansion audio processing: 3D stereo widening
• Post Mastering to improve DAC fidelity
• Dual I²S outputs with crossover

A highly integrated Bluetooth module is ideal for economical Bluetooth stereo audio solutions. It features a 2.4GHz ISM RF transceiver, Bluetooth V4.0 baseband controller, flash memory, on-board antenna, and high-quality 24-bit stereo audio CODEC.

With Bluetooth stack running on a host, designers can easily customize their applications to support different Bluetooth profiles.

Main Features:

• Bluetooth v4.0, Class 1.5
• UART programming and data interface (baud rate can up to 921600bps)
• Analog (Input/output)/PCM/I2S audio interface
• I2C/AIO/PIO/PWM control interfaces
• Postage stamp size form factor
• Embedded Bluetooth stacks: SPP/iAP, HID, GATT, ANCS,A2DP,AVRCP,HFP, etc
• OTA upgrade support
• MFI Certification
• Support External Antenna
• RoHS compliant